PEEK Engineering Resin
Designed and faricated interposer for MEMS ultra sonic transducer chip scale package.
Ultem Engineering Resin
Designed shipping tray to accommodate 20 four pinned MEMS devices.
Delrin / Acrylic
Type II PVC
6061-T6 Aluminum Alloy
Custom designed and machined prototype unit for possible mass production.
Designed and fabricated package for high resolution LCOS microdisplay to be used in microprojection system.
Display Funtional Ulrasonic Transducers